 |
FM-1
Connective FPCs for Notebook
Computers (Hinge-Cable,Touch-Pad,
CD-ROM,FDD,Docking) |
| |
|
Key
Specifications/Special Features:
|
 |
FCCL:
polyimide-based or polyester-based |
|
Thickness:
|
| |
Copper
foil : 1/2oz,1oz,2oz |
| |
Base film and Coverlay :1/2mil,1mil,2mil
|
|
Coverlay:Polyimide,Polyester
or Solder Mask |
|
Adhesive:
Epoxy or Acrylic type |
|
Surface
treatment: |
| |
Plating:Tin-lead(or
HAL),nickel,gold |
| |
screen:Cu-cream,Ag-cream(for
EMI shielding) |
| |
Liquid
photo image S/M |
|
Stiffener:2mil
to 7mil Polyamide,3mil to 10mil Polyester
or |
| |
0.2mm
to 1.2mm FR-4 |
|
QC
standard: IPC -TM- 650, JIS - C5016 |
|
Min.
Trace Width: 3mil |
|
Min.
Trace Gap: 3mil |
|
Component
assembling service:SMT,DIP |
|
FM-2
High Quality Polyimide Based
Camera - Zooming & Connective Cables |
|
|
Key
Specifications/Special Features:
|
|
FCCL:
Polyimide-based |
|
Thickness:
|
| |
Copper
foil: 1/2oz, 1oz |
| |
Base
film and coverlay: 1/2mil, 1mil (polyamide)
|
|
Coverlay:
polyamide |
|
Adhesive:
epoxy or acrylic type |
|
Surface
treatment: |
| |
Tin-lead
or gold plating |
| |
Heat
resistance, anti-corrosion |
|
QC
standard: IPC -TM-650 , JIS- C5016 |
|
Min.
trace width: 3mil |
|
Min.
trace gap: 3mil |
|
FM- 3 FPC (D/S) for
Camera Mainboard
|
| |
|
Key
Specifications/Special Features:
|
|
FCCL
: Polyimide-based |
|
Thickness:
|
| |
Copper
foil : 1/2oz, 1oz |
| |
Base
film and Coverlay : 1/2mil, 1mil (polyimide) |
|
Coverlay
: Polyimide |
|
Adhesive
: Epoxy or Acrylic type |
|
Surface
treatment : Gold plating |
| |
Heat
resistantance, Anti-corrosion |
|
QC
standard : IPC -TM-650 , JIS- C5016
|
|
Min.
Trace Width : 3mil |
|
Min.
Trace Gap : 3mil |
|
Component
assembling service : SMT |
|
FM-
4 FPC (S/S) for Printer Cable |
| |
|
Key
Specifications/Special Features:
|
|
FCCL:
Polymide-based or Polyester based |
|
Coverlay:
Polyamide or Polyester |
|
Adhesive:
Epoxy |
|
Surface
treatment: |
| |
Gold
plating |
| |
Dimple
punch: (tolerance +0.05mm) |
|
QC
standard: IPC -TM-650 , JIS- C5016 |
|
Min.
Trace Width: 3mil |
|
Min.
Trace Gap: 3mil |
|
FM-
5 Dependable & Durable FPC
(D/S) For STN LCD |
| |
|
Key
Specifications/Special Features: |
|
FCCL:
polyimide-based with adhesive |
|
Thickness:
|
| |
Copper
foil: 1oz double-sided |
| |
Base
film:1mil |
| |
Coverlay
film: polyimide 1mil |
|
Adhesive:
epoxy type |
|
Surface
Treatment: |
| |
Plating:tin-lead
6 + - 4um (or per customer's specs)
|
|
QC
standard: IPC -TM-650 , JIS- C5016 |
|
Min.
trace width: 3mil |
|
Min.
trace gap: 3mil |
|
Exposed
conductor ends with via hole |
|
FM-
6 Reliable FPC (S/S) For 15"
TFT LCD |
| |
|
Key
Specifications/Special Features: |
|
FCCL:
polyimide-based,w/o adhesive |
|
Thickness:
|
| |
Copper
foil: 1oz,double-sided |
| |
Base
film : 1/2mil |
| |
Coverlay
film: polyimide 1/2mil |
|
Adhesive:
epoxy type |
|
Surface
treatment: |
| |
Plating:
|
| |
Tin-lead
8+ - 4 um(or per customer's specs) |
|
Stiffener:FR-4,t=0.2~0.25mm |
|
QC
standard: IPC -TM-650 , JIS- C5016 |
|
Min.
trace width: 3mil |
|
Min.
trace gap: 3mil |
|
Finest
pitch:0.5mm |
|
FM-
7 Reputable Pre-Punched FPC
(S/S) For FSTN LCD Competitively Priced |
| |
|
Key
Specifications/Special Features:
|
|
FCCL:
polyimide-based |
|
Thickness:
|
|
Copper
foil: 1oz |
|
Coverlay film: polyimide 1mil |
| |
Gold
plating |
| |
Dimple
punch: (tolerance +0.05mm) |
|
Adhesive:
epoxy type |
|
Surface
treatment: |
| |
Plating:
|
| |
Tin-lead 6 +
- 4 um(or per customer's spec) |
|
QC standard:
IPC -TM-650 , JIS- C5016 |
|
Min. trace width:
3mil |
|
Min. trace gap:
3mil |
|
FM-
8 Value For Money FPC (S/S)
For STN/TFT LCD (COG Type)
|
| |
|
Key
Specifications/Special Features:
|
|
FCCL:
polymide-based |
|
Thickness:
|
| |
Cooper
foil:1/2oz,1oz(per spec) |
| |
Base film:1/2mil,1mil(per Spec) |
| |
Coverlay:
polyamide 1/2mil,1mil per spec |
|
Adhesive:
epoxy type |
| |
Surface
treatment: |
| |
Plating:gold,0.15
+ - 0.9um(or per customer's spec) |
| |
Nickel:3~9
um |
|
Packing:mild
adhesive sheet upholds the finished
|
| |
products to
ensure quality |
|
QC
standard: IPC -TM-650 , JIS- C5016 |
|
Min.
trace width: 3mil |
|
Min.
trace gap: 3mil |
|
FM-9
FPCS for Aerospace and
Telecommunications |
|
|
Key
Specifications/Special Features:
|
|
Number
of layers: 2 |
|
Minimum
line width: 0.15 mm |
|
Minimum
line space: 0.15 mm |
|
Minimum
hole diameter: 0.5 mm |
|
Type:
plated-through hole (DIP) |
|
Base
laminated materials: polyimide |
|
Board
technology: through-hole |
|
Surface
plating: tin lead |
|
CAD
software (PCB approval): auto CAD |
|
| FM-10
FPCS for CD-ROMs |
|
|
Key
Specifications/Special Features:
|
|
Number
of layers: 2 |
|
Minimum
line width: 0.125 mm |
|
Minimum
line space: 0.125 mm |
|
Minimum
hole diameter: 0.4mm |
|
Type:
plated-through hole (DIP) |
|
Base
laminated materials: polyimide |
|
Board
technology: through-hole |
|
Surface
plating: tin lead |
|
CAD
software (PCB approval): auto CAD |
|
| FM-11
FPCS for LCD Monitors |
|
|
Key
Specifications/Special Features:
|
|
Number
of layers: 2 |
|
Minimum
line width: 0.15 mm |
|
Minimum
line space: 0.15 mm |
|
Minimum
hole diameter: 0.5 mm |
|
Board
technology: through-hole |
|
Base
laminated materials: polyimide |
|
Surface
plating: tin lead |
|
CAD
software (PCB approval): auto CAD |
|
| FM-12
FPCS for Hard Disks |
|
|
Key
Specifications/Special Features:
|
|
Number
of layers: 1 |
|
Minimum
line width: 0.18 mm |
|
Minimum
line space: 0.18 mm |
|
Base
laminated materials: polyimide |
|
Surface
plating: gold |
|
CAD
software (PCB approval): auto CAD |
|
FM-13
FPCS for Electronic Dictionaries
and PDAs |
| |
|
Key
Specifications/Special Features:
|
|
Number
of layers: 1 |
|
Minimum
line width: 0.18 mm |
|
Minimum
line space: 0.18 mm |
|
Base
laminated materials: polyimide |
|
Surface
plating: gold |
|
CAD
software (PCB approval): auto CAD |
|
FM-14
FPCS for Mobile Phones and
Batteries |
|
|
Key
Specifications/Special Features:
|
|
Number
of layers: 1 |
|
Minimum
line width: 0.3 mm |
|
Minimum
line space: 0.3 mm |
|
Minimum
hole diameter: 1.2 mm |
|
Base
laminated materials: polyimide |
|
CAD
software (PCB approval): auto CAD |
|
| FM-15
FPCS for Automatic Equipment |
|
|
Key
Specifications/Special Features:
|
|
Number
of layers: 1 |
|
Minimum
line width: 0.2 mm |
|
Minimum
line space: 0.2 mm |
|
Surface
plating: 4 |
|
Base
laminated materials: polyimide |
|
CAD
software (PCB approval): auto CAD |
|
Coating: gold
flash |
|
| FM-16
FPCS for More 3C Products |
| |
|
Key
Specifications/Special Features:
|
|
FPCS
product range: |
| |
Single-sided
|
| |
Double-sided
|
| |
Multi-layer
|
| |
Rigid-flex
|
|
Applications:
|
| |
LCDs,
cameras, printers, HDD, FDD, notebook
computers, |
| |
telecom
devices, |
| |
medical
instruments as well as many |
| |
more
3C products! |
|
FM-21
4-Layer Rigid-Flex for Mobile
Phones (Mainboard) |
| |
|
Key
Specifications/Special Features:
|
|
4-layer
rigid-flex |
|
Base
film: Polyamide |
|
Coverlay:
Polyamide |
|
Adhesive:
Pyralux 1mil to 3mil |
|
Via
hole: 0.3mm |
|
Surface
treatment: |
| |
Tin-lead
or Gold plating |
| |
Heat
resistance, Anti-corrosion |
|
QC
Standard: IPC - TM - 650 , JIS C5016
|
|
Min. Trace Width:
3mil |
|
Min. trace gap:
3mil |
|
Component assembling
service: SMT |
|
Tail-made to
customer's requirement |
|
